Heritage & Precision

The Planar Process, Evolved for Space

Building on Fairchild Semiconductor's revolutionary 1959-1960 breakthrough — the foundation of all modern integrated circuits — evolved for orbital environments.

Visit PlanarPrecision.com

Historical Foundation

The Revolution That Started It All

In 1959-1960, Jean Hoerni at Fairchild Semiconductor invented the planar process — a method of fabricating transistors on a flat silicon surface using oxide layers for protection and isolation.

This breakthrough enabled the creation of integrated circuits and launched the semiconductor industry as we know it. Every chip in every device you use today traces its lineage back to this fundamental innovation.

1959

Planar process invented

1960

First planar IC produced

1959

Planar Process Patent

Jean Hoerni files patent for planar transistor fabrication at Fairchild Semiconductor

1960

Integrated Circuit

Robert Noyce combines planar process with integrated circuit concept

1968

Intel Founded

Fairchild alumni found Intel, scaling planar technology globally

2025+

Orbital Evolution

Planar Precision evolves the process for space manufacturing

Space Evolution

Why Planar Process Excels in Orbit

The same principles that made the planar process revolutionary on Earth become even more powerful in the microgravity environment of space.

Perfect Layer Deposition

Without gravity-induced flow variations, oxide and metal layers deposit with unprecedented uniformity across the entire wafer surface.

Earth:Thickness varies up to 5%
Space:Uniformity within 0.1%

Defect-Free Crystals

Silicon crystal growth in microgravity eliminates convection-driven defects, producing substrates with orders of magnitude fewer imperfections.

Earth:10⁴ defects/cm²
Space:<10² defects/cm²

Contamination Elimination

The natural vacuum of space eliminates particle contamination, reducing the complexity and cost of clean room operations.

Earth:Class 1 cleanroom required
Space:Natural ultra-clean

Higher Integration Density

Cleaner processes and better substrates enable smaller feature sizes and higher transistor densities than Earth-based fabs.

Earth:Limited by contamination
Space:10x density potential

Novel Material Systems

Space enables growth of III-V compounds and exotic semiconductors that are difficult or impossible to produce terrestrially.

Earth:GaAs, InP limited
Space:Full periodic table

Energy Efficiency

Free solar power and radiative cooling reduce energy costs, making energy-intensive processes economically viable.

Earth:$0.10-0.20/kWh
Space:~$0.01/kWh equivalent

Our Family

Two Domains, One Mission

International Space Manufacturing and Planar Precision work as complementary pieces of the same vision.

ISM

International Space Manufacturing

internationalspacemanufacturing.com

The collaborative hub focused on the orbital hybrid vision, ecosystem partnerships, and bringing together major players in space manufacturing.

  • Orbital manufacturing vision
  • Ecosystem collaboration
  • Hybrid production model
PP

Planar Precision

planarprecision.com

The foundational precision engineering philosophy and historical roots that underpin our orbital innovations.

  • Heritage planar process
  • Precision engineering
  • Technical foundations

Part of the Pinnacle Empire

Explore Our Heritage

Visit PlanarPrecision.com to dive deeper into the engineering philosophy, historical foundations, and technical details behind our orbital innovations.